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BHOSCH ELECTRONICS APPLIED TECHNOLOGY PRIVATE LIMITED

About Us

BHOSCH Electronics Applied Technology (BEAT) has set up the modern the facilities for manufacturing the ceramic substrate PCBs and different types packages. We can support low-medium- and large quantities ceramic PCBs, assembly of dice, wire bonding, metal packages and epoxy encapsulations. We can make custom ceramic PCBs and packages of any design as per customer requirement.

Activities

Manufacturing the ceramic substrate PCBs and different types packages, Thick film Printed Ceramic Substrates, Thin film sputtered and patterned Ceramic Substrates, Direct Bonded Copper Substrates, Microelectronics Assembly, Functional Electrical Testing, Environmental and Screening Testing.